AMD to invest over $10 billion in Taiwan semiconductor ecosystem
Advanced Micro Devices said it will invest more than $10 billion across Taiwan's semiconductor ecosystem to deepen partnerships and expand advanced packaging capacity for future AI infrastructure. The effort involves ODM partners Sanmina, Wiwynn, Wistron and Inventec to move Helios-based systems powered by Instinct MI450X GPUs, 6th Gen EPYC CPUs, networking gear and the ROCm software stack from design into high-volume manufacturing. AMD is also working with ASE and SPIL to qualify a wafer-based 2.5D bridge interconnect called EFB to improve bandwidth and power efficiency for Venice CPUs, and Helios deployment remains on track for the second half of 2026.
AMD will invest more than $10 billion in Taiwan semiconductor ecosystem
Context
AMD announced a large investment to expand packaging and manufacturing in Taiwan. The…
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