SK Hynix and Sandisk publish high-bandwidth flash specification
SK Hynix and Sandisk published the industry's first open specification for high-bandwidth flash (HBF) at Flash Memory Summit 2026 via the Open Compute Project, with Google and Tenstorrent as contributors. HBF uses HBM-style stacking and advanced packaging applied to NAND flash to create a middle memory tier with higher capacity near processors, promising up to 512 GB per stack and future bandwidth grades near 3.0 TB/s. The specification targets inference workloads to lower costs, reduce power and cut SSD transfers, but it is a blueprint: samples are expected in the second half of 2026 and devices may appear in early 2027.
HBF supports up to 512 GB per stack and 3.0 TB/s.
Context
Chipmakers built faster GPUs but memory bandwidth lagged. HBM supply tightened and HBM…
The full analysis
19 dimensions on this story — world impact, market read, and what happens next.
- Full ContextLocked
- Affected SectorsLocked
- Stock ImpactLocked
- Economic IndicatorHyperscalers backing open hardware…Locked
- Investor RelevanceLocked
- Professional RelevanceLocked
- Watch PointsHBF sample availability in second half…Locked
- Probability of ChangeLocked
- Debate PointsWhether NAND latency and endurance…Locked
- Prerequisite KnowledgeLocked
- Follow-up QuestionsWill major GPU and accelerator makers…Locked
- Pros & ConsCloud providers: reduce inference costs…Locked