SK hynix unveils iHBM cooling for next-generation HBM
SK hynix unveiled iHBM, a next-generation high-bandwidth memory cooling technology that embeds an integrated cooling element (ICE) inside the HBM package and places it in the D2D PHY area where heat concentrates most. The company says iHBM lowers thermal resistance by more than 30% versus existing models while using an advanced MR-MUF-based WLP process already validated in the market, which supports stable volume manufacturing and high SiP design compatibility. SK hynix plans to apply iHBM to next-generation products such as HBM5, aiming to improve thermal management for AI data centers and high-performance computing environments.
iHBM cuts HBM package thermal resistance by over 30 percent
Context
HBM has grown hotter as stacking and speeds increased. AI data centers and HPC systems…
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